4, used for metal, glass, ceramics, PCB board, semiconductor devices, plastic and other objects bonding, sealing, fixing.
1, clean: clean the surface of the construction substrate dust, water, oil and other impurities, and keep dry.
2, sizing: the glue is extruded and coated on the surface of the substrate, and then the other side is glued.Do not force the bonding part before the complete curing, so as not to affect the curing and bonding strength.Good ventilation should be maintained during sizing and curing.
1, sizing and curing process can not be operated in a closed environment, should maintain good ventilation.
2, the production process should strengthen ventilation and personal protection work, prohibit open fire, and away from the source of fire and heat source.
3, handling light, packaging cover should be promptly covered, not used up glue should be sealed well.
4, the test of the performance parameters should be carried out at least 48 hours after sizing, at this time the glue is completely cured.
5. For more data and information related to electronic silica gel, please consult Shenzhen Yoneng Company for relevant advice and help.
VI. [Packaging and Storage]
1. This product is packed in 100ml/ piece, 300ml/ piece, 2.6L/ piece.
2. This product is a general product, stored sealed in a ventilated, dry, cool, dark place, shelf life of 10 months.
Contact: MR, SUN
Add: SHENZHEN GUANGDONG CHINA